New Products and Services
Die Pad Kits
CVInc introduced its pad replacement program in March 2014. This provides customers with bumped die an opportunity to convert to wirebondable die. Pads are available in Ni, Pd, Au and Cu finishes.
Wirebonding to bumped die is not an option................
A wirebond tip will only plow through the solder and not find a surface
to adhere. CVI provides an optional solution by replacing solder bumps with pads that are wirebondable. The pads can be removed and
the bumps replaced should the flip chip die need to be attached in standard flip chip mode.
Read the extended article on PCB repair.
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